微合科技

集微聚合,芯联万物

深圳市微合科技有限公司(United Micro Technology (Shenzhen) Co. Ltd.)是一家专注于领先的5G智能蜂窝通信芯片设计的国际化高科技企业。公司成立于2022年8月22日,总部位于深圳市,并于西安,德国,奥地利设有四个研发中心, 在美国设有分公司。

微合科技核心团队由全球无线通信行业资深专家组成。 公司基于最新的3GPP协议标准,进行eMBB、RedCap和海量物联网产品的研发,致力于成为世界一流的蜂窝物联网产品及解决方案提供商。

为什么我们将会成功?

技术

充分利用成熟的IP生态系统

加速夯实技术基础建设

专注于打造差异化的知识产权/产品

人才

具备吸引优秀人才的全球网络和合作伙伴

长期积累的蜂窝无线通信软硬件平台开发专业知识

资本

与可靠的投资者合作,以确保强大的财务基础

通过审慎的资本管理保障长期金融稳定

客户

与客户方案深度优化的机会

秉承以客户为中心的理念,实现持续的客户满意度和忠诚度

管理团队

每位核心成员均具备超过20年的蜂窝及汽车电子芯片研发经验,并已成功在全球售出数十亿调制解调器芯片组

我们的愿景

Connect. Things | 集微聚合,芯联万物

我们的使命

Create. Wireless SoC Solutions | 专注于无线SoC解决方案,与客户共同开创物联网连接的未来。

Company Mission and Vision

Vision - We are committed to providing the best intelligent, secure and reliable Cellular IoT solutions to the world.

  • Fast operational efficiency and adaptability;
  • Focusing on and deeply embedding in our target vertical areas;
  • Creating value for customers by optimizing the total operating costs of the Internet of Things.

Mission - Deliver customer value through products

  • Full use of mature IP ecosystem and focus on differentiation of core IP;
  • Adoption of highly mature and efficient software development processes and frameworks in hardware and platform development;
  • Application of the latest design methodology to guarantee design efficiency and effectiveness;
  • Strengthening design automation and optimization based on AI/ML.;

Company Mission and Vision

Vision - We are committed to providing the best intelligent, secure and reliable Cellular IoT solutions to the world.

  • Fast operational efficiency and adaptability;
  • Focusing on and deeply embedding in our target vertical areas;
  • Creating value for customers by optimizing the total operating costs of the Internet of Things.

Mission - Deliver customer value through products

  • Full use of mature IP ecosystem and focus on differentiation of core IP;
  • Adoption of highly mature and efficient software development processes and frameworks in hardware and platform development;
  • Application of the latest design methodology to guarantee design efficiency and effectiveness;
  • Strengthening design automation and optimization based on AI/ML.;

核心价值

诚信

诚实守信,表里如一;

客户至上

恪守承诺,言出必行;

协同领导

快速反应,高效决策;使命共担,成就共享;

结果驱动

目标清晰,以终为始;通力合作,责无旁贷;

卓越的技术能力

远见卓识,精益求精;积微成著,厚积薄发;

承担经过考量的风险

审慎决策,无惧创新;勇于尝试,善于学习;

有趣

全情投入,享受工作;和谐共赢,氛围愉悦;

Integrity

we act truthfully and transparent without hidden agenda, and we don't let others fail.

Customer First

we commit and deliver to our promise.

Result Driven

we do what matters, align key results with the company's objectives, and address performance issues when they arise.

Technical Excellence

 we take pride in excelling in technical aspects over competition.

Collaborative Leadership

we assume leadership on all levels, and we own our issues and share our successes.

Taking Educated Risks

we innovate fearlessly, and learn & pivot from mistakes quickly.

Having Fun

we enjoy what we are doing, and celebrate together every progress and achievement.

管理团队

CEO

符晖

前英特尔基带研发负责人,带领团队成功大规模量产超过30款芯片产品,总出货量超20亿片;

iPhone 7到iPhone 11基带研发总负责人。

VP - Algo & System Architecture

Bernd Eggers

前英飞凌、英特尔及苹果的算法及系统架构总负责人,超过25年的半导体IC设计从业经验;

负责苹果5G芯片SoC总体系统架构及数据处理(data plane) 算法;

研发的无线通信芯片曾用于苹果、三星、Nokia及索尼爱立信等品牌手机。

 

VP - RF & Program

Dr. Thomas Lueftner

前Silicon Austria Labs C TO及5G/6G射频及毫米波研发负责人;

曾任英特尔第一代4G产品线平台研发负责人及客户平台和运营商项目负责人;

对无线通信产品架构、软硬件划分及大型无线平台项目的管理超过二十年的实战经验。

VP - Baseband IP

Dr. 刘鉴伟

前英特尔5G SDR 基站 LTE IP 硬件研发负责人及架构/RTL负责人;

超过 25 年的半导体 IC 设计从业经验; 

深入研究 LTE / 5G 基带解码及干扰消除算法及实现(Turbo / LDPC / Polar / CWIC);

拥有 6 项国际专利。

VP - SoC & IP Development

王凛

曾担任山东云海国创芯片研发总监、浪潮人工智能研究院副院长、国家云计算装备产业中心副主任,主持以服务器周边为目标的高速互联,计算加速等芯片的开发;

前英特尔西安代总经理,基带SoC开发设计总监;

超过24年IC设计经验,参与发表EI及SCI论文计19篇,提交和参与专利申报超过110份,并已获授权40余项。

研发中心分布

慕尼黑
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林茨
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德累斯顿
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西安
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深圳
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